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System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Frontiers in Energy 2018, Volume 12, Issue 1,   Pages 109-120 doi: 10.1007/s11708-018-0540-8

Abstract: Thermoelectric coolers are among the most promising techniques for dealing with localized on-chip hot

Keywords： thermoelectric cooling     thermal management     optimization     high flux electronics    

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Optimization Strategy of MPEG-4 AAC Decoder on a Low-cost SoC

Gao Gugang,Shi Longxing,Pu Hanlai,Zhou Fan

Strategic Study of CAE 2007, Volume 9, Issue 10,   Pages 60-64

Abstract: fix-point conversion scheme based on statistical analysis and performance oriented customizing scheme for on-chipmemory's capacity,  and presents optimization methodology based on these strategies for computation

Keywords： software optimization     SoC     FFC     on-chip memory     AAC    

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On-Chip LiDAR Technology Advances for Cars, Cell Phones

Mitch Leslie

Engineering 2022, Volume 18, Issue 11,   Pages 3-5 doi: 10.1016/j.eng.2022.09.003

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A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Review

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Engineering 2023, Volume 26, Issue 7,   Pages 185-197 doi: 10.1016/j.eng.2022.10.019

Abstract: Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chipFlux values have increased exponentially with a simultaneous reduction in chip size and a significantEmbedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlikeAlthough embedding the cooling solution onto an electronic chip results in a high heat transfer potential

Keywords： Electronic cooling     Embedded cooling     Immersion cooling    

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Super-Resolution Displacement Spectroscopic Sensing over a Surface “Rainbow” Article

Lyu Zhou, Nan Zhang, Chang Chieh Hsu, Matthew Singer, Xie Zeng, Yizheng Li, Haomin Song, Josep Jornet, Yun Wu, Qiaoqiang Gan

Engineering 2022, Volume 17, Issue 10,   Pages 75-81 doi: 10.1016/j.eng.2022.03.018

Abstract: For these applications, miniaturized spectrometers are desirable to enable the on-chip analysis of spectralHere, we report a unique “rainbow” trapping metasurface for on-chip spectrometers and sensorsmanipulation of efficiently coupled rainbow plasmonic resonances reveals a new platform for miniaturized on-chipusing exosomal epidermal growth factor receptor (EGFR) expression values, thereby demonstrating a new on-chip

Keywords： Rainbow trapping     Metasurface     Surface plasmon polaritons     Super-resolution displacement     On-chip biosensing    

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An extended thermo-mechanically coupled algorithm for simulation of superelasticity and shape memoryeffect in shape memory alloys

S. HASHEMI,H. AHMADIAN,S. MOHAMMADI

Frontiers of Structural and Civil Engineering 2015, Volume 9, Issue 4,   Pages 466-477 doi: 10.1007/s11709-015-0300-3

Abstract: Thermo-mechanical coupling in shape memory alloys is a very complicated phenomenon.temperature-dependent variation of its mechanical behavior in the forms of superelasticity and shape memoryproposed based on the original model of Lagoudas to efficiently model both superelasticity and shape memory

Keywords： shape memory alloy     thermo-mechanical coupling     superplasticity     shape memory effect    

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1,   Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip     defect detection     ultrasonic excitation     vibration analysis    

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Application of metal magnetic memory test in failure analysis and safety evaluation of vessels

Yiliang ZHANG, Song YANG, Xuedong XU

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 1,   Pages 40-48 doi: 10.1007/s11465-009-0003-3

Abstract: Metal magnetic memory test (MMMT), which is a new subject in the field of nondestructive examination,

Keywords： Metal magnetic memory test (MMMT)     nondestructive testing (NDT)     residual stress     propylene purifier     ammonia    

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Hyperglycemic memory in diabetic cardiomyopathy

Frontiers of Medicine 2022, Volume 16, Issue 1,   Pages 25-38 doi: 10.1007/s11684-021-0881-2

Abstract: This process is now referred to as hyperglycemic memory (HGM) phenomenon.

Keywords： diabetes     diabetic cardiomyopathy     hyperglycemic memory    

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On-chip optical interconnect using visible light Article

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Frontiers of Information Technology & Electronic Engineering 2017, Volume 18, Issue 9,   Pages 1288-1294 doi: 10.1631/FITEE.1601720

Abstract: Monolithic optical interconnect chip integrates the emitter,waveguide, base, and collector into a multi-componentin-plane visible light communication to light-inducedartificial synaptic devices, intelligent display, on-chip

Keywords： Homogeneous integration     Multiple-quantum-well diode     Visible light interconnection     Coexistence of light emission and photodetection    

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its control

Keywords： LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

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Temperature effects of shape memory alloys (SMAs) in damage control design of steel portal frames

Xiaoqun LUO, Hanbin GE, Tsutomu USAMI

Frontiers of Structural and Civil Engineering 2012, Volume 6, Issue 4,   Pages 348-357 doi: 10.1007/s11709-012-0176-4

Abstract: study is to analytically investigate temperature effects of an axial-type seismic damper made of shape memory

Keywords： damage control design     shape memory alloy     temperature effect    

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor     three-dimensional     single-chip     in-plane rotation    

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A novel shape memory alloy actuated soft gripper imitated hand behavior

Frontiers of Mechanical Engineering 2022, Volume 17, Issue 4, doi: 10.1007/s11465-022-0700-8

Abstract: The limited length shrinkage of shape memory alloy (SMA) wire seriously limits the motion range of SMA-based

Keywords： shape memory alloy (SMA)     pre bent     wire     gripper     grasping mode     lightweight    

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4,   Pages 472-472 doi: 10.1007/s11465-009-0077-y

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Title Author Date Type Operation

System-level Pareto frontiers for on-chip thermoelectric coolers

Sevket U. YURUKER, Michael C. FISH, Zhi YANG, Nicholas BALDASARO, Philip BARLETTA, Avram BAR-COHEN, Bao YANG

Journal Article

Optimization Strategy of MPEG-4 AAC Decoder on a Low-cost SoC

Gao Gugang,Shi Longxing,Pu Hanlai,Zhou Fan

Journal Article

On-Chip LiDAR Technology Advances for Cars, Cell Phones

Mitch Leslie

Journal Article

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated

Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia

Journal Article

Super-Resolution Displacement Spectroscopic Sensing over a Surface “Rainbow”

Lyu Zhou, Nan Zhang, Chang Chieh Hsu, Matthew Singer, Xie Zeng, Yizheng Li, Haomin Song, Josep Jornet, Yun Wu, Qiaoqiang Gan

Journal Article

An extended thermo-mechanically coupled algorithm for simulation of superelasticity and shape memoryeffect in shape memory alloys

S. HASHEMI,H. AHMADIAN,S. MOHAMMADI

Journal Article

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Journal Article

Application of metal magnetic memory test in failure analysis and safety evaluation of vessels

Yiliang ZHANG, Song YANG, Xuedong XU

Journal Article

Hyperglycemic memory in diabetic cardiomyopathy

Journal Article

On-chip optical interconnect using visible light

Wei CAI, Bing-cheng ZHU, Xu-min GAO, Yong-chao YANG, Jia-lei YUAN, Gui-xia ZHU, Yong-jin WANG, Peter GRÜNBERG

Journal Article

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Journal Article

Temperature effects of shape memory alloys (SMAs) in damage control design of steel portal frames

Xiaoqun LUO, Hanbin GE, Tsutomu USAMI

Journal Article

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Journal Article

A novel shape memory alloy actuated soft gripper imitated hand behavior

Journal Article

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Journal Article